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Board-Level Defects Examined
Wednesday, July 11, 2012 | Real Time with...IPC APEX EXPO 2012

Dr. Jennie S. Hwang discusses key issues related to board-level defects, such as pad cratering, conductive anode filament formation (CAF), and solderability defects. Dr. Hwang also notes that lead-free assembly has placed significant stress on printed wiring board assemblies and discusses packaging trends such as BTC.

Watch the interview here.


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