Following are some of the products to be presented at IPC Printed Circuits Expo/APEX/Designers Summit, February 18 – 22, 2007, in Los Angeles. Look for more product information in our APEX Product section in the February issue, and online leading up to the show.

Viscom Americas, Inc., with corporate headquarters in Hanover, Germany, will debut the X7056 3-D automatic X-ray inspection (AXI) system in Booth 1326. The system incorporates proprietary high-performance microfocus X-ray tubes for 15 µm-per-pixel resolution. Iterative Easy3D software manages image quality. It features parallel top and bottom optical inspection to increase throughput, and the option of AOI cameras to simultaneously inspect and X-ray PCBs. Compatible with other Viscom systems, the X7056 offers optional VPC software, with various filter functions, for process monitoring.

AMTECH of Branford, CT, created a core wire solder to match its LF-4300 lead-free solder paste, on display at Booth 1817. The core wire, for hand soldering and automated assembly, complements the paste in low voiding, mid-chip beading, and tombstoning. It suits standard aqueous cleaning systems.

IP Systems LLC (Suwanee, Ga.) will introduce a mid-size filter unit designed to remove solder fumes from reflow ovens and selective solder systems. Eliminating roof-top venting, the unit filters and recirculates exhaust. The next-generation fan/motor assembly generates 600cfm airflow with a suction force of 7" WC. The unit features dual air-inlet ports, and will be highlighted at Booth 2767.

Speedline Technologies of Franklin, Mass., will introduce the Camalot FX-D dispensing system at Booth 1853. It operates as a stand-alone or in-line system. The machine can be heated or unheated for flexible manufacturing environments.