IPC - Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO™, held April 6-8, 2010 in Las Vegas, Nevada.

Awards were presented to individuals who made significant contributions to IPC and industry by lending their time and expertise to committees and standards and programs development.

Special Recognition award recipients were:

• David Hillman and Doug Pauls, Rockwell Collins; Les Bogert, Bechtel Plant Machinery, Inc.; Kathy Johnston, Raytheon Missile Systems; Linda Woody, Lockheed Martin Missile & Fire Control; Blen Talbot, L-3 Communications; and Donald McFarland, Inovar, Inc., for their extraordinary contributions to J-STD-001E, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610E, Acceptability of Electronic Assemblies.
• Leo Lambert, EPTAC Corporation; Teresa Rowe, AAI; and Daniel Foster, Defense Acquisition Inc., for their contributions to IPC-A-610E.
• Constantino Gonzalez, ACME Training & Consulting; Mel Parrish, STI Electronics; Jennifer Day, U.S. Army/Stanley Associates; and Garry McGuire, NASA Marshall Space Flight Center, for their contributions to J-STD-001E.

Distinguished Committee Leadership awards were presented to:

• Jack Fischer, Interconnect Technology Analysis, Inc., for his leadership of the 8-40 Roadmap Executive Committee that developed the 2009 International Technology Roadmap for Electronic Interconnections.
• Clark Webster, ALL Flex LLC and Michael Beauchesne, Amphenol Printed Circuits, Inc., for their leadership of the D-13 Flexible Circuits Base Materials Subcommittee that developed revision A of IPC-4202, Flexible Base Dielectrics for Use in Flexible Printed Circuitry.
• Mel Parrish, STI Electronics, for leadership of the 7-30 Product Assurance General Committee and guidance to the task groups that developed IPC-610E; IPC-A-600H, Acceptability of Printed Boards; IPC-AJ-820, Assembly & Joining Handbook, and related support documents.
• Constantino Gonzalez, ACME Training & Consulting and Jennifer Day, U.S. Army/Stanley Associates, for their leadership of the 7-31b IPC-A-610 Task Group that developed IPC-A-610E.
• Leo Lambert, EPTAC Corporation, for leadership of the 5-20 Assembly and Joining Materials General Committee and guidance to the task groups that developed J-STD-001E, the Space Electronic Hardware Addendum, the Handbook for J-STD-001 and the many test and material support documents.
• Teresa Rowe, AAI and Daniel Foster, Defense Acquisition Inc., for leadership of the 5-22a J-STD-001 Task Group that developed J-STD-001E.
• Randy Reed, Viasystems Group, Inc. and Mark Buechner, BAE Systems, for leadership of the 7-31a and D-33a task groups that developed IPC-A-600H and IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards.
• Jack McCullen, Intel Corporation; Lee Wilmot, TTM Technologies, Inc. and Jasbir Bath, Bath Technical Consultancy, for leadership of the 4-34 Marking and Labeling Task Group that worked on J-STD-609A, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (PB-Free) and Other Attributes.
• Eric Simmon, NIST and Mark Frimman, Texas Instruments Inc., for leadership of the 2-18 Supplier Declaration Committee that worked on IPC-1751A, Generic Requirements for Declaration Process Management and the development of IPC-175x Schema Version 2.0. Another Distinguished Committee Service award was presented for their leadership of the 2-18b Materials Declaration Task Group that developed IPC-1752A, Materials Declaration Management.
• Fritz Byle, Astronautics Corp. of America and Frank Rossman, Jabil Circuit, Inc., for leadership of the 2-18a Manufacturing Process Declaration Task Group that developed IPC-1756, Manufacturing Process Data Management.