ORPRO Vision, a global provider of automated optical inspection (AOI) solutions for the electronics assembly industry, will showcase its complete range of AOI systems at the IPC APEX Expo in booth #2365. APEX takes place April 6-8, 2010, at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
ORPRO Vision will demonstrate its Symbion series of paste and component inspection systems and the new table top prototype AOI system.
Symbion S36 Plus delivers top-of-the-line, full 3-D component AOI performance, pre-reflow and post-solder, to help customers achieve outstanding operational efficiency and high first-pass yields in even the most demanding SMT or PTH environments.
The Symbion S36 Plus uses ORPRO Vision's application software which minimizes programming complexity and reduces production debugging efforts. The new software meets the requirements of easy and fast programming independent from process variations like PCB and components colours, alloy type, etc.
More tests can now be refined and debugged using the intuitive DPIX interface. This simple to use interface allows the user to see the effect of changes in real-time, without repetitive testing. These features are fully-complemented by ORPRO Vision's unique off-line programming and optimization concept, newly extended with a one-click learning feature for the built-in-intelligence learning tests: refine and debug programs offline without any impact on production throughput.
With an extremely low cost per board inspection and features, such as our robust hardware architecture, customized board handling, data exportation, copy-exact capability and high-end features, such as logical operands, OCR, OCV, etc.., the competitively priced Symbion S36 Plus is one of the most attractive 3-D AOI tools on the market.
For paste deposition analysis, the Symbion P36 Plus meets two important requirements: speed and precision. The solution is our patented Parallel Optical Path, POP, head structure. The Symbion P36 Plus creates dual, fully independent laser driven channels to analyze 100% of the board by complementary 2-D and 3-D methods.