The green manufacturing in electronics market is segmented based on its application as, electronics, portable electronics, industrial, automotive, and others. Based on the technology the green manufacturing market I segmented as, lead free and halogen free manufacturing.

AIM Solder announces that NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux and has a medium residue suitable for long thermal demands.

"Global regulations, lead-free technology, evolving manufacturing processes, reliability demands, and R&D issues are transforming the way medical device companies manage their supply chains," said Sanjay Huprikar, IPC vice president of member success. The Innovations in Electronics in Manufacturing for Medical Devices conference will address these issues and more in June.

Brook Sandy-Smith's presentation, "Reliability Challenges for Bottom Termination Components," discusses electro-chemical reliability, assembly defects, and alloy reliability of bottom termination components, such as BGAs, CSPs, MLFs, QFNs, and D-Paks. The presentation will also cover the unique challenges of bottom termination components and strategies for optimization.

Mike Jones, MicroCare vice president, said, "UltraClean really captured the attention of visitors to our stand at NEPCON. Everybody in Asia uses alcohol to clean their boards during rework and most of them have problems with its performance."

FCT Assembly has appointed CDK Sales Solutions as a manufacturers’ representative for Southern California. Craig Kowalski, president of CDK Sales Solutions, has been in the soldering industry for 25 years and is anxious to grow the business for FCT Assembly.

As a result of IPC and other industry lobbying efforts, the RoHS2 Directive published in the European Union Official Journal did not include any additional substance restrictions in Annex II. However, RoHS2 called for the EU Commission to review additional substances for restriction. The Commission is required to complete its review of Annex II by July 2014.

In compliance with the RoHS Directive initiated by the EU and later deployed globally, SAC305 of SnAgCu (SAC) system has been used as a lead-free solder interconnection alloy for both second- and third-level interconnection since the implementation of lead-free electronics. After a 10-year run, Dr. Jennie Hwang takes a look at SAC305 for IC packages and PCB assembly.

It's been six years since the implementation of the lead-free initiative and Dr. Ron Lasky, Indium Corporation's senior technologist, joins Guest Editor Kelly Dack to examine three basic issues that determine the health of the consumer and PCB industry after going lead free.

How much do subtle variations in alloy composition affect the performance and process requirements of PCB assembly? This paper from Brook Sandy and Ron Lasky, Ph.D. compares alternative lead-free alloys to SAC305 to determine if existing processes should be modified.

Delegates from 16 countries packed the EIPC Winter Conference to exchange information on market conditions and future innovations, and Technical Editor Pete Starkey was there. Following two excellent, sobering keynote presentations on world market trends, the technical program commenced with a session on new substrates and surface finishes.