This paper outlines the process associated with soldering stacked packages using dip flux and dip solder pastes specifically designed to overcome the incidence of package warp. Based on the process issues involved, inspection results are presented to better illustrate the challenges in implementing PoP into production.

Rental programs for XRF Analyzers have become increasingly popular in recent years as a method of solving short term testing needs. To meet this growing need, QSX Instruments LLC has announced a variety of rental options for their Handheld XRF Analyzer.

Walter Jager, Director of Engineering for Intertek, sits down with Editor Ray Rasmussen to discuss the latest challenges electronics manufacturers are facing with restricted substances. An SVHC designation is the first step in restricting substances for use in electronics.

IPC will hold the first Electronics Assembly Quality & Reliability Conference on October 6-7, 2010 in Budapest, Hungary.

RoHS 2 is intended to be an improved version of the existing RoHS legislation; the objective is to develop a regulatory process that is simple, understandable, effective and enforceable. The approval vote is provisionally set for October 2010.

IMAPS-UK held a one-day technical seminar on June 30, 2010, in conjunction with IeMRC, The Welding Institute and NPL in Teddington, UK, to provide an opportunity to discover more information about new interconnection processes and materials that are increasingly providing alternatives to conventional solder.

With the advent of lead-free solders, as well as the spike in tin prices, the moderate economic pain of dross generation has become acute. This paper will show the true cost of dross, including metal replacement, loss of efficiency and safety, as well as environmental and quality issues associated with the elimination of dross.

Working together to address the latest round of proposed substance restrictions, IPC and the IPCA have submitted comments in response to the Indian Government's Ministry of Environment and Forests draft notification of E-waste (Management and Handling) Rules 2010.

As solder suppliers formulate more variations on the lead-free solder theme, it appears that standardization is needed. But who's going to take ownership of the problem? Guest Editor Jasbir Bath and Indium Corporation Senior Technologist Dr. Ron Lasky have a spirited discussion on this proliferation problem.

We've made it our mission to bring readers in-depth technical content from leading companies, organizations and associations to broaden expertise and understanding of the issues at the forefront of readers' minds. Tune in each week for new content from industry leaders around the globe.

This paper outlines the process associated with soldering stacked packages using dip flux and dip solder pastes specifically designed to overcome the incidence of package warp. Based on the process issues involved, inspection results are presented to better illustrate the challenges in implementing PoP into production.

Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!

Walter Jager, Director of Engineering for Intertek, sits down with Editor Ray Rasmussen to discuss the latest challenges electronics manufacturers are facing with restricted substances. An SVHC designation is the first step in restricting substances for use in electronics.

With the advent of lead-free solders, as well as the spike in tin prices, the moderate economic pain of dross generation has become acute. This paper will show the true cost of dross, including metal replacement, loss of efficiency and safety, as well as environmental and quality issues associated with the elimination of dross.

As solder suppliers formulate more variations on the lead-free solder theme, it appears that standardization is needed. But who's going to take ownership of the problem? Guest Editor Jasbir Bath and Indium Corporation Senior Technologist Dr. Ron Lasky have a spirited discussion on this proliferation problem.

The effect of post-reflow cleaning processes on creep corrosion are discussed in this paper from Alcatel-Lucent.The authors examine a laboratory MFG test that replicates field creep corrosion. Comparisons of creep corrosion susceptibility between OSP and ImAg PWB surface finishes are also made.

The new symposium will help attendees get up to speed on the latest regulatory developments from around the globe, including chemical regulations in Asia, changes to REACH and RoHS, implementation of system for labeling chemicals, the Canadian Chemicals Management Plan and California's Green Chemistry Initiative.

Werner Engelmaier, noted author and expert in all things reliability, discusses reliability issues related to lead-free and RoHS. He notes three failure modes he's seeing more of: Pad cratering, trace lifting/buckling and "eyebrow" cracking. Adjusting board cooling rates can help tackle such issues, but, sometimes, that's not enough.

I-Connect007's team of editors, guest editors, videographers and video editors worked throughout the show to capture the keynotes, the industry's top technologists and business leaders, bringing our readers and viewers the world's most comprehensive event coverage and content.

It is very unfortunate that Toyota has run into a wall with issues concerning unintended acceleration in some of its vehicles, but you have to wonder: What happened to Design Verification Testing?

Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!

With proper planning, stiffeners can be designed to aid assembly through the designed manufacture of a flex circuit that can be handled as if it were a rigid circuit board. Such constructions can be accomplished by using any one of several methods.

Walter Jager, Director of Engineering for Intertek, sits down with Editor Ray Rasmussen to discuss the latest challenges electronics manufacturers are facing with restricted substances. An SVHC designation is the first step in restricting substances for use in electronics.

RoHS 2 is intended to be an improved version of the existing RoHS legislation; the objective is to develop a regulatory process that is simple, understandable, effective and enforceable. The approval vote is provisionally set for October 2010.

With the advent of lead-free solders, as well as the spike in tin prices, the moderate economic pain of dross generation has become acute. This paper will show the true cost of dross, including metal replacement, loss of efficiency and safety, as well as environmental and quality issues associated with the elimination of dross.

Corner cracks are observed less often than barrel cracks, but with high-rel boards, we can't be too careful. Unlike barrel cracks, which can fail catastrophically, knee cracks tend to propagate over time. The damaged pad actually resembles a funnel and the warp and weft of the glass give the funnel an uneven, puckered shape.

As solder suppliers formulate more variations on the lead-free solder theme, it appears that standardization is needed. But who's going to take ownership of the problem? Guest Editor Jasbir Bath and Indium Corporation Senior Technologist Dr. Ron Lasky have a spirited discussion on this proliferation problem.

Trade shows and conferences are vital to the PCB assembly world. Where else can you meet so many potential customers and suppliers? Still, you can't make every industry event, and if you can’t be there, our Real Time With... video coverage is the next best thing to being there.

I-Connect007's Real Time with... has produced over 3,000 video interviews, conference presentations and product reviews at major events around the world. Past events include IPC APEX Expo, productronica, IPC Midwest, SMTA International, Mexitronica, NEPCON China and many more.

We've made it our mission to bring readers in-depth technical content from leading companies, organizations and associations to broaden expertise and understanding of the issues at the forefront of readers' minds. Tune in each week for new content from industry leaders around the globe.

Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!

With proper planning, stiffeners can be designed to aid assembly through the designed manufacture of a flex circuit that can be handled as if it were a rigid circuit board. Such constructions can be accomplished by using any one of several methods.

Corner cracks are observed less often than barrel cracks, but with high-rel boards, we can't be too careful. Unlike barrel cracks, which can fail catastrophically, knee cracks tend to propagate over time. The damaged pad actually resembles a funnel and the warp and weft of the glass give the funnel an uneven, puckered shape.

The North American PCB industry is stronger--in spite of appearances to the contrary. Industry strength will help secure its place in the next chapter. The challenge will be to survive the winding down of Moore's Law on silicon while other materials and processes emerge to make possible future electronics advancements.

InterNEPCON Japan was established as a trade show dedicated exclusively to manufacturers and vendors associated with circuit board assembly, but has since evolved into one of Asia's largest exhibitions for electronics packaging, including SMT assembly.

IPC's Technet offers a snapshot of the issues of the day as hundreds of engineers attempt to sort out the industry's latest technological challenges. Harvey Miller, PCB007 columnist and President of Fabfile Online, has agreed to gather a few of the latest Technet exchanges for our Tech Tuesday readers.

The list of replacements for eutectic tin-lead keeps growing, and now, over three years after implementation of the lead-free mandate, new alloys are still being developed. How do you cut through the clutter and find the right alloy?

As 2010 approaches, I-Connect007's European Editor, Pete Starkey, decided to take a look back at the year's top technical articles--compiling a list of the most popular articles across the site.

"Cool" is no longer about how fast a car goes or how great it looks, but, rather, what it can do to keep you connected while you're getting there. Some will still choose the "vroom," but more and more will opt to spend money on the electronics over the engine.

At the moment, the search for the Holy Grail--a solder that is a direct replacement for tin-lead--has lost a few participants, but the quest goes on within solder manufacturers. However, a replacement seems as elusive as the original.