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NEWS    May 18, 2013
PAGE 1 of 39.     NEXT 10 RESULTS
 
GOEPEL "EMS Partner Program" to Share Knowledge
Thursday, May 16, 2013 | GOEPEL Electronic    
"The cooperation network particularly aims for improving the interaction between development and production to provide a better understanding of the respective requirements," says Enrico Lusky, sales manager, Germany.
Multitest Exhibits and Presents at ECTC
Wednesday, May 15, 2013 | Multitest    
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, will exhibit at the upcoming ECTC, scheduled to take place May 28-30, 2013 at The Cosmopolitan in Las Vegas, Nevada.
PC-based Inspection Simplifies Hardware & Reduces Cost
Wednesday, May 15, 2013 | UIC/Cognex    
"Our previous generation of vision systems provided excellent performance, but the integration costs and complexity of the previous VME-based vision hardware were excessive," said Damon Ashman, vision manager for Universal Instruments.
MatriX Strengthens Market Position; Acquires FocalSpot
Wednesday, May 08, 2013 | MatriX Technologies    
MatriX plans to make a significant investment to further develop and enhance FocalSpot’s current X-ray product line with its advanced engineered hardware and software technology platforms.
Agilent Upgrades Electronic Instrument Control & Automation Software
Tuesday, May 07, 2013 | Agilent Technologies Inc.    
Agilent Technologies Inc. has announced the latest enhancement on its Command Expert software for faster and easier instrument control in many test application development environments.
GOEPEL's New topoVIEW Allows Evaluation of X-ray Images
Monday, May 06, 2013 | GOEPEL Electronic    
As an essential component of its new X-ray inspection software XI-Pilot V 3.1, the company introduces a new module for an easier evaluation of X-ray images. topoVIEW facilitates the interpretation of recorded X-ray images with respect to a better fault assessment and classification.
ARTICLES    May 18, 2013
PAGE 1 of 11.     NEXT 10 RESULTS
 
Environmental Testing Drives High-Reliability Electronics
Tuesday, May 14, 2013 | Real Time with...IPC    
Robert Nelson, VP and GM for Cincinnati Sub-Zero (CSZ), talks about the importance of environmental testing in the manufacture and development of high-reliability electronic products. Not just for OEMs, environmental testing helps manufacturers dial in their processes and gain a competitive advantage.
EPTAC's Lambert on Counterfeit Training, New Canada Location
Thursday, May 02, 2013 | Real Time with...IPC    
Leo Lambert, vice president and technical director of solder training and IPC certification corporation EPTAC, discusses the firm's newest training program developed with the help of IDEA, one designed to help customers better identify counterfeit parts. Lambert also details EPTAC's move into the Canadian market and his committee work with IPC.
JTAG President: Growth in China Fuels New Products
Thursday, April 25, 2013 | Real Time with...NEPCON China    
Peter van den Eijnden, president of JTAG Technologies, a company based in the Netherlands, discusses the many changes he's seen in his 15+ years of doing business in China. The growth in the Chinese domestic market has sparked an expanded need for testing, fueling a line of JTAG products.
Conformal Coating Inspection: What Do You See?
Wednesday, March 27, 2013 | Dr. Lee Hitchens, SCH Technologies    
Dr. Lee Hitchens takes a look at conformal coating standards, what they actually mean, what you can achieve with new automated conformal coating inspection technology, and what must be considered to ensure a reliable inspection process.
EIPC Winter Conference: Specialization - Europe's Advantage, Part I
Tuesday, February 12, 2013 | Pete Starkey, I-Connect007    
Delegates from 16 countries packed the EIPC Winter Conference to exchange information on market conditions and future innovations, and Technical Editor Pete Starkey was there. Following two excellent, sobering keynote presentations on world market trends, the technical program commenced with a session on new substrates and surface finishes.
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