Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will give several presentations at the 63rd Electronic Components and Technology Conference (ECTC) May 28-31 in Las Vegas, Nevada.

The full-day workshop will provide attendees with a wealth of information on good and bad practices in high-reliability hand soldering, rework, and repair. It will highlight what some think are correct procedures, but, in fact, are poor work habits which can result in unacceptable solder joints and repairs.

Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the International Microelectronics and Packaging Society (IMAPS) Advanced Technology Workshop on Microelectronic Packaging for Medical and Hi-Reliability Devices May 13-14 in Minneapolis, MN.

The webinar will present the ReUSE (Reuseable, Unzippable, Sustainable Electronics) project, an innovative printed electronics solution to increase the recyclability of electronic assemblies.

Indium6.4 Water-Soluble Solder Paste's flux chemistry minimizes voiding under QFN and BGA assemblies. A typical water-soluble solder paste has approximately 15 to 30% voiding; however, Indium6.4 consistently yields less than 5%.

FCT Assembly has appointed CDK Sales Solutions as a manufacturers’ representative for Southern California. Craig Kowalski, president of CDK Sales Solutions, has been in the soldering industry for 25 years and is anxious to grow the business for FCT Assembly.

OEMs striving to cut costs and shorten design and manufacturing cycle time are not shy about asking suppliers to do more. As certain end markets segregate into low-, middle-, and higher-tier product lines, OEMs are also developing concurrent strategies to address both cost and time-to-market.

Leo Lambert, vice president and technical director of solder training and IPC certification corporation EPTAC, discusses the firm's newest training program developed with the help of IDEA, one designed to help customers better identify counterfeit parts. Lambert also details EPTAC's move into the Canadian market and his committee work with IPC.

Bryan Steffen, SMT manager & process engineer, faced a challenge: Demand for his company's products was increasing exponentially, yet new products were being introduced. Learn how he increased productivity without sacrificing quality, extending delivery times, or increasing cost.

Aculon, Inc.'s Director of R&D Eric Hanson describes to Technical Editor Pete Starkey how self-assembled monolayer nanotechnology can improve the performance of solder paste stencils.

William Crist, Apex Factory Automation's national sales manager, joins Guest Editor Susan Mucha on the IPC APEX EXPO show floor to discuss how his company's turnkey SMT placement line solution automates solder paste measurement, speeds changeover, and supports placement of smaller components.

Delegates from 16 countries packed the EIPC Winter Conference to exchange information on market conditions and future innovations, and Technical Editor Pete Starkey was there. Following two excellent, sobering keynote presentations on world market trends, the technical program commenced with a session on new substrates and surface finishes.

The Annual General Meeting of the Institute of Circuit Technology was held in the historic town of Arundel and was followed by a well attended evening seminar. Attendees received updates from two RTD partners in the ASPIS FP7 project, a look at developments in re-usable electronics, and a user view of a revolutionary solderable finish. Pete Starkey reports.

How does one examine solder joint microstructure? Is the microstructure important? This month, Dr. Jennie S. Hwang continues a series that addresses the practical aspects of solder joint microstructure and what it can tell us about solder joint reliability. The focus of this offering is the role of the phase diagram in microstructure.

How does one examine solder joint microstructure? Is the microstructure important? This month, Dr. Jennie S. Hwang continues a series that addresses the practical aspects of solder joint microstructure and what it can tell us about solder joint reliability.

Although minimum solder joint sizes have stabilised in the 0.3 to 0.4 mm range and soldering technology is currently under control, it is projected that joint sizes could reduce to the 0.1 to 0.2 mm range by 2020. What would be the consequences on manufacturability and reliability?