The MPM Momentum Compact printer by Speedline Technologies is a faster, more precise Momentum-series printer that delivers cutting-edge performance in an unexpectedly small package.

ZESTRON's Fernando Gazcon, application engineer, will present "Stencil and Misprint Cleaning' at the 2013 SMTA Queretaro Tech Day on Thursday, May 9.

The MPM® EnclosedFlow™ print head by Speedline Technologies is a revolutionary enclosed media printing technology that offers significant process and cost advantages over printing with metal squeegee blades.

Kyzen® E5615 is an innovative aqueous-based stencil cleaner. It removes unreflowed solder paste from stencils and other related equipment without requiring a rinse.

The MPM Momentum® Compact high-performance printer, equipped with the new EnclosedFlow™ Print Head and the Camalot® Prodigy™ dispense system, were exhibited for the first time in Europe, and were well received, according to Bruce Seaton, European sales manager.

Photo Stencil, LLC, a leading full-service provider of high-performance stencils and tooling, introduces its new Interactive Squeegee Blade Selection Guide.

Dr. William Coleman examines stencil technologies and aperture wall coatings to determine how these parameters influence paste transfer for miniature devices with area ratios less than the standard recommended lower limit of 0.5. A matrix of print tests are utilized to compare paste transfer and measure the effectiveness of the different stencil configurations.

MYDATA's Global Sales Director for Jet Printing, Nico Coenen, joins Editor Ray Rasmussen to discuss the advantages of jet solder paste printing. While not perfect for every application, this technology is gaining more and more acceptance in the industry.

Looking back at 2011, two events stood out for me and for most of us I would suspect. First the disasters in Asia certainly captured the world and disrupted business for entire industries; next, the untimely death of "Mr. Reliability," Werner Engelmaier.

Editor Pete Starkey breaks down the additional 13 technical presentations offered during Day 2 of EIPC's 2011 Autumn Conference, held in Basel, Switzerland: Themed Strategic Technologies and Industry Challenges for Business Success in Europe. Starkey was impressed with the quality and depth of each topic discussed.

Jean-Marc Peallat re-explores the need for 3-D solder paste inspection (SPI). With advanced processes now demanding the use of smaller components, the use of in-process inspection becomes more important and could become a standard feature to ensure quality success. In this scenario, 3-D SPI will assume a more important role in the test strategy.

Editor Pete Starkey breaks down the additional 13 technical presentations offered during Day 2 of EIPC's 2011 Autumn Conference, held in Basel, Switzerland: Themed Strategic Technologies and Industry Challenges for Business Success in Europe. Starkey was impressed with the quality and depth of each topic discussed.

Over the past 20 years, the size of electronic packages has continued to shrink as the density of I/O leads has increased.