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In this issue, we explore the processes and chemistries that make up traditional subtractive etch and plate. We also investigate the confluence of smaller dimensions, reduced pollution, higher throughput, and improved reliability...
In this issue, we explore the processes and chemistries that make up traditional subtractive etch and plate. We also investigate the confluence of smaller dimensions, reduced pollution, higher throughput, and improved reliability as they relate to wet processes and plating. Further, we address some of the emerging processes for higher performance designs and new equipment to implement modern techniques.
Features
Articles
Columns
From autonomous vehicles to e-textiles to automotive standards, our contributors take a look under the hood and kick the tires this month to bring the rapidly evolving world of automotive electronics into perspective.
From autonomous vehicles to e-textiles to automotive standards, our contributors take a look under the hood and kick the tires this month to bring the rapidly evolving world of automotive electronics into perspective.
Features
Columns and Articles
Our feature contributors have plenty to say this month, including thought-provoking ideas and unique perspectives they’ve accumulated in the quest for successful sales and marketing strategies. We open this issue with results of our monthly survey on the topic at hand, and a breakdown of the responses.
Our feature contributors have plenty to say this month, including thought-provoking ideas and unique perspectives they’ve accumulated in the quest for successful sales and marketing strategies. We open this issue with results of our monthly survey on the topic at hand, and a breakdown of the responses.
Features
Columns
This month, we take on failure, and a few industry experts are on hand to back us up! Topics range from the power of systems when combating failure and how supplier improvement drives product improve-ment, to avoiding circuit failure in high-rel applications and the copper plating process.
This month, The PCB Magazine is taking on failure, and a few industry experts are on hand to back us up! Topics range from the power of systems when combating failure and how supplier improvement drives product improve-ment, to avoiding circuit failure in high-rel applications and the copper plating process.
ARTICLES
The War on Process Failure by Patty Goldman
The War on Failure by David Dibble
Fighting the War on Failure with Supplier Analytics: An Interview with Fane Friberg
Latent Short Circuit Failure in High-Rel PCBs due to Cleanliness of PCB Processes and Base Materials by Stan Heltzel
Feature Summary: Declaring War on Failure in Electronics by Stephen Las Marias
Plating and Quality are Close Partners by Bob Tarzwell
Designing Flex Circuits for Domestic Prototyping by Tara Dunn
This month: end markets for PCBs! From the future of the domestic mil/aero market (looking good!) to wearables, automobiles, very thin PCBs for smartphones, and more!
Features
Columns
More
Don’t forget: If you have some expertise of your own to share in the form of a feature article or column, or just want to share some feedback with us on something you’ve read on our pages, please drop us a line!
Our industry is embarking on a new age of technical development to achieve much higher levels of overall reliability that will be required of the devices we fabricate.
Our industry is embarking on a new age of technical development to achieve much higher levels of overall reliability that will be required of the devices we fabricate. Medical devices will be relied upon to keep us living in many more situations. Autonomous vehicles will need to be failure-free to keep riders and pedestrians alike safe in the world. IoT will bring opportunities to put smart electronics in new places, performing unthought-of ways. Reliability will be crucial to both our success and safety.
Features
Feature Columns
Columns
No doubt, new technology seems to be launching daily, from inspection systems to photoresist processes. How can we keep up? How can we even maintain? What’s coming next next and how can we best prepare, to stay in the game?
No doubt, new technology seems to be launching daily, from inspection systems to photoresist processes. How can we keep up? How can we even maintain? What’s coming next and how can we best prepare, to stay in the game? This month, our experts give us a heads up on new technology: where we’re at and where on Earth we are going.
Features
Columns
Blind, buried, landless…IPC defines no less than seven type of vias. This month, our experts shed light on the many different types of vias, their functions, and the various challenges associated with them.
Blind, buried, landless…IPC defines no less than seven type of vias. This month, our experts shed light on the many different types of vias, their functions, and the various challenges associated with them.
Table of Contents
Features
Interviews and Columns
This month, The PCB Magazine takes an in-depth view of the supply chain—from various approaches to making it work for you, to what history has shown about its many iterations, and how some suppliers are setting the bar very high for the future of supply chain management.
This month, The PCB Magazine takes an in-depth view of the supply chain—from various approaches to making it work for you, to what history has shown about its many iterations, and how some suppliers are setting the bar very high for the future of supply chain management.
Columns
More…
Do you have some expertise of your own to share with the readers of The PCB Magazine? We welcome your ideas for a feature article or column. Please drop us a line!
LPKF, Optomec and Transline Technology explore up and coming technologies for PCB fabrication, layout and more.
Table of Contents
Features
Columns
More…
Don’t forget: If you have some expertise of your own to share in the form of a feature article or column, or just want to share some feedback with us on something you’ve read on our pages, please drop us a line!
The design team’s files and the accompanying documentation is the real-world implementation plan to turn the OEM’s concepts and marketing research into a viable, physical, competitive product, this is where it all starts!
According to a press release published by SCORE on May 23, 2019, “98.6% of American manufacturing companies are small businesses, and 75.3% of those businesses have fewer than 20 employees.” SCORE is an organization that mentors to America's small businesses. The report continues, “Last year, manufacturing businesses generated 11.6% of the U.S. economic output and employed 8.5% of the U.S. workforce, but 89% of manufacturers report that they cannot fill all job openings.”
This report looks at all manufacturing, but it’s clear that the electronics industry trends are consistent with manufacturing in general. There are also a large number of small businesses in our sector.
Our topic this month, however, is “Everything Starts With Design,” so what does that have to do with quality, staffing shortages, or small business? Pretty much everything.
As OEMs drive electronics manufacturers to improve processes to simultaneously build a product at two orders of magnitude more reliability, where does a fabricator even begin to concentrate its efforts to get the best improvement in output? Some will tell you that getting the best possible quality on the input is where you should start.
The design team’s files and the accompanying documentation is the real-world implementation plan to turn the OEM’s concepts and marketing research into a viable, physical, competitive product. Unless manufacturing defies the build instructions from the designers, the product will only be as manufacturable as the design files themselves. The higher the quality of the design, the more robust the contingencies specified in the bill of materials, and the more materials tolerances have been thought through and expressed in the build notes, the better the end result will be coming through fabrication.
And given all of the simultaneous challenges facing PCB fabricators with respect to staffing, new equipment, environmental impact, etc., making the communication process with your OEM customers efficient seems like the logical first step in stepping up to new challenges.
Features
Articles
Column
Who is your customer? Isn’t it more than that person who buys something from you or your company? After all, aren’t the tables turned when you request something from that “customer?” Aren’t you then the customer? Find out what our experts think this month. The answers may surprise you!
Who is your customer? Isn’t it more than that person who buys something from you or your company? After all, aren’t the tables turned when you request something from that “customer?” Aren’t you then the customer? Find out what our experts think this month. The answers may surprise you!
Features
Columns
Everyone has the chance to benefit from the wealth of experiences our contributors—leaders in the industry—are sharing this month, from real-world examples of leadership, to principles that have stood the test of time.
Everyone has the chance to benefit from the wealth of experiences our contributors—leaders in the industry—are sharing this month, from real-world examples of leadership, to principles that have stood the test of time.
Features
Columns
This month, a comprehensive view of the scope of flex circuit technology is presented in features from OM Group, Multek, DuPont, ESI, and more.
This month, a comprehensive view of the scope of flex circuit technology is presented in features from OM Group, Multek, DuPont, ESI, and more.
Featured Articles
Featured Columns
What is the story with printed electronics? Where have they been and where are they going? Most importantly, how are they being used in today’s market?
What is the story with printed electronics? Where have they been and where are they going? Most importantly, how are they being used in today’s market? These questions and more are addressed by this month's feature contributors from IPC, OE-A, and more. Features
How do current materials stack up? We find out. First, we lay down some high-level perspective on materials, megatrends in materials, and economic forces at play in the market. Then, we layer in specifics with materials manufacturers in this our materials issue.
In the May issue of PCB007 Magazine, first, we lay down some high-level perspective on materials starting with Alun Morgan’s perspective on the future of PCB materials. Then, columnist Tara Dunn writes about “New Materials or New to You?” Next, we have a conversation with Panasonic’s Tony Senese on megatrends in materials. These three pieces deliver a panoramic primer on materials, opportunities, activity, and global economic forces at play in the market.
Then, our conversations get more specific, including discussions with John Andresakis and Jonathan Weldon from DuPont; Ken Parent from Insulectro; TUC America’s Alan Cochrane; Sean Mirshafiei from Isola; and a second conversation specific to Panasonic materials with Tony Senese.
Interspersed, you’ll find columns from Dr. John Mitchell on industry outlooks, Jan Pedersen on traceability and reliability, Steve Williams on training new employees, Todd Kolmodin on probers and testers, and Mark Ladle takes us on a brisk, poignant customer visit as a traveling engineer.
In addition, we’re proud to bring you a tour of Microtek Labs’ Chinese facility. Barry Matties and Edy Yu from the I-Connect007 China team spoke with Bob Neves about growing a business in China.
This makes for quite a stack of information on materials. What we learned—and hope you will take away as well—is that understanding the current trends in materials will require everyone from designers to material manufacturers and the entire manufacturing chain to talk, collaborate, and listen to each other to best master these new materials in the real world.
Features
Columns
Bonus Article
As equipment gets more sophisticated and costly, determining equipment needs has become far more complicated. Choosing wisely--and correctly anticipating your and the market’s needs--has never been more critical.
As equipment gets more sophisticated and costly, determining equipment needs has become far more complicated. Choosing wisely—and correctly anticipating your and the market’s needs—has never been more critical. Our experts are well equipped to give us their professional perspectives on just what to consider when evaluating new equipment.
Features
SPECIAL SECTION: IPC APEX EXPO 2018 Pre-Show Coverage
Columns
Check out our Career Opportunities section.
Participating in the military and aerospace industries is not for the faint of heart, nor for those lacking persistence or looking for the quick project or sale. Our feature contributors this month, which include several of our regular columnists, provide valuable insight on the mil/aero market and what is required to be in the game.
Features
Columns & Articles
This month, features from Michael Carano, (Carano & Associates), a team from Dow Chemicals Company, and George Milad (Uyemura) share their perspectives on plating and etching issues.
This month, features from Michael Carano, (Carano & Associates), a team from Dow Chemicals Company, and George Milad (Uyemura) share their perspectives on plating and etching issues.
Features:
Optimization of Acid Copper Electrodeposition Processes for High-Throwing Power DC Plating by Michael Carano
Electroplating Through-Holes with Different Geometry: A Novel and High-Productivity Process by Elie Najjar, et al.
ENEPIG: The Plating Process by George Milad
The Importance of Harmonized Standards that Benefit All: An Interview with Amphenol's Sean Keating by Pete Starkey
Columns
Best Practices 101: Part 7 by Steve Williams
Quick-Turn Circuit Board Shops by Karl Dietz
This month, The PCB Magazine feature contributors take an in-depth look at embedded components, including our cover story by EIPC’s Michael Weinhold:Device Embedding in PCBs: Evolution or Revolution
Our July line-up includes our cover story byEIPC’s Michael Weinhold: Device Embedding in PCBs: Evolution or Revolution? Other feature contributors include John Andresakis, et al. (Oak Mitsui), Daniel Brandler and Manuel Herrera (Ohmega Technologies Inc.), and Todd Kramer (Secure Components).
As the electronics industry works to overcome an impending staffing and skills shortage, it will be the youth who will rise to the challenge, build on the work of the current industry experts, and move technology into a higher orbit.
Features
Feature Columns
Articles
Columns
Increasing consumer demands for high-performance and the need for high-reliability in sectors such as automotive, LED lighting, and renewable energy mean that thermal management is now front and center on the priority list for PCB manufacturing.
Increasing consumer demands for high-performance and the need for high-reliability in sectors such as automotive, LED lighting, and renewable energy mean that thermal management is now front and center on the priority list for PCB manufacturing. This month, industry experts are in the hot seat to explain how to keep everything cool.
Feature Content
Columns
Welcome to this month’s topic—Voices of the Industry—otherwise known as YOU! We’ve surveyed readers, including engineers, fabricators, technologists, CEOs, and others... to find out exactly what’s on their mind when it comes to today’s electronics manufacturing industry.
Features
Article
Columns
This month, HDI gets the scrutiny of industrial professionals from TTM Technologies, Multek, and Gardien Services, who discuss the challenges of ultra-thin HDI PCB manufacturing, and how HDI relates to the Internet of Things (IoT) and substrate test fixtures.
This month, high density interconnect gets the scrutiny of industrial professionals from TTM Technologies, Multek, and Gardien Services, who discuss the challenges of ultra-thin HDI PCB manufacturing, and how HDI relates to the Internet of Things (IoT) and substrate test fixtures.
TABLE OF CONTENTS
Features
Next-Generation Ultra-Thin HDI PCB Manufacturing Challenges by Tarja Rapala-Virtanen, Erkko Helminen and Timo Jokela
High-Density Interconnects: Enabling the Intelligence of Things by William Beckenbaugh, Ph.D. and Joan K. Vrtis, Ph.D.
Splitting Hairs: The Manufacture of HDI and Substrate Test Fixtures by Todd Kolmodin
The Challenges of the Fast-Moving Wearables Market - an Interview with Dr. Joan Vrtis by Barry Matties
Columns
Best Practices 101: Part 6 by Steve Williams
Copper Discoloration and Other Concerns with OSP by Michael Carano
Electrical Test: Surface Finish vs. Water Marks by Todd Kolmodin
Design Considerations: Flexible Circuit vs. Traditional PCB by John Talbot
This month, The PCB Magazine features industry experts who discuss all things flex: from substrates to hybrid stretchable circuits to 3D packaging tools and more! Don’t miss it!
This month, our cover feature by Scott Gordon (DuPont Teijin Films) explores polyester films for the flex industry. Inside features include articles from A. Robinson, et al., (Journal of Applied Physics), who take a look at hybrid stretchable circuits; Joe Fjelstad (Verdant Electronics) discussing some basic principles of PTF flex circuits; and All Flex’s Dave Becker, who examines 3D packaging tools.
Don’t forget: Real Time with…video from IPC APEX EXPO, a brand new I-Connect007 Panel Discussion (What’s New in Flex?) columns, and more, including Pete Starkey’s update on the ECWC13 held in Nuremberg, Germany in May.
The acceptance of smart factories is a global movement across multiple industries. In electronics manufacturing specifically, China seems to be a key leader in the move to Industry 4.0.
The acceptance of smart factories is a global movement across multiple industries. In electronics manufacturing specifically, China seems to be a key leader in the move to Industry 4.0. Once seen as an industrial heavyweight that depended on a huge labor pool, the environment in China has transformed. Chinese culture has a history of adaptability, and China’s industry-leading implementation of Industry 4.0 concepts is demonstrating that essential skill to the globe once again. What stands out about the Chinese transition is that automation—robotics, in particular—is a surprisingly small part of the whole solution. Our March issue of SMT007 Magazine includes interesting articles based on our recent visit to two Chinese PCB smart factories. You'll find direct links to those articles in this issue.
We start off this month with “The Smart Factory IQ Test” where you can quiz your conceptual Industry 4.0 knowledge. Next, Barry Matties visits Ventec International Group’s China-based facility. Laminate isn’t considered a high-mix, low-volume business—especially in China—but that’s exactly Ventec’s approach.
From people to technology, I-Connect007 Technical Editor Happy Holden and factory automation pioneer posts an overview of the “Hardware and Software in Smart Factories.” The PCB Norsemen consider smart factory technologies and the move into implementation around the globe, and Steve Williams discusses the key elements making up Industry 4.0 technologies.
Dr. John Mitchell, IPC president and CEO, introduces the IPC Education Foundation in his column, which is a 501c(3) organization to assist students and the emerging workforce.
Tara Dunn shares an example of doing business that serves as a great metaphor and reminder. The real smarts in any factory are—and will continue to be—the people who perform the most complex, heuristic analyses of all. Read her column titled “Old-fashioned Networking.”
In “Optimizing the OSP Processes for High Performance,” Michael Carano discusses organic solderability preservatives (OSPs). Todd Kolmodin’s column dives into creating “Confidence in Inspection” with a discussion of third-party inspection. And Mark Ladle, “The Travelling Engineer,” shares an anecdote about his initial experiences traveling overseas as a field engineer.
Returning to China, we bring you a report from the 2018HKPCA & IPC Show in Hong Kong. Mr. Hu Yang provides an overview of how the Chinese domestic market is developing and changing the fabrication industry.
Features
Columns
Article
This month, we cover the wide-ranging topic of HDI: from the latest technology developments and manufacturing challenges, to HDI strategies that include design, fabrication, and assembly perspectives.
This month, we cover the wide-ranging topic of HDI: from the latest technology developments and manufacturing challenges, to HDI strategies that include design, fabrication, and assembly perspectives. As one of our feature contributors, Happy Holden, says, in North America, there is a growing need for more HDI capability. Find out why in this issue!
TOC:
Feature Content
Columns
There’s more to test and inspection than the latest and greatest AOI and electrical test equipment. This month, feature contributors from Orbotech, Gardien Services, Uyemura, and more, examine various testing methods that go into ensuring great product.
There’s more to test and inspection than the latest and greatest AOI and electrical test equipment. This month, feature contributors from Orbotech, Gardien Services, Uyemura, and more, examine various testing methods that go into ensuring great product.
Features
Columns
This month, feature contributors from Isola, Ventec, OMG and Spirit Circuits examine the range of materials for multiple applications, including flame retardancy, high-speed designs, reliability testing and LED applications.
Features:
Columns:
More:
This month, we bring you a line-up of experts who explore both common and unique plating & etching issues, techniques and challenges.
This month, our features include industry veteran Mike Carano, who brings a detailed look at direct metallization for complex IC designs in this month’s cover feature; Henning Huebner and a team from Atotech, Germany, explore the challenges of copper filling of BMVs, and Dr. Andy Cobley et al., from Coventry University, U.K., share their findings on the effect of low frequency ultrasound on catalysed electroless copper plating.
We’re also bringing you fresh Real Time with...videos from IPC APEX EXPO 2014, an in-depth panel discussion video Has Outsourcing Lost its Luster? sponsored by Prototron Circuits, interesting columns and more!
Things are changing in our industry, so is it any surprise that how you sell your services is changing too? If your sales approach seems out of focus, then join us as we look at some successful PCB selling and marketing strategies.
Things are changing in our industry, so is it any surprise that how you sell your services is changing too? If your sales approach seems out of focus, then join us as we look at some successful PCB selling and marketing strategies including staffing, hiring, branding, and more. Bring your sales channel into sharp relief.
Feature Articles
Feature Columns
Columns
As board features get smaller, as speeds get faster, and as more is expected from everyone in the supply chain, signal integrity should have everyone’s attention. This month, our experts explain why.
If you think signal integrity is just a design problem, think again. As board features get smaller, as speeds get faster, and as more is expected from everyone in the supply chain, signal integrity should have everyone’s attention. This month, our experts explain why.
Feature Content
Columns
Fine features are the topic this month, and our industry experts are on hand to discuss issues ranging from landless vias to laser direct imaging and high throw electroless copper for very small holes and blind vias.
Fine features are the topic this month, and our industry experts are on hand to discuss issues ranging from landless vias to laser direct imaging and high throw electroless copper for very small holes and blind vias.
Features
Against the Density Wall: Landless Vias Might be the Answer, by Happy Holden
Flexible Circuit Fabrication and Cleanroom Manufacturing, by Dave Becker, All Flex Flexible Circuits
High-Throw Electroless Copper—New Opportunities for IC Substrates and HDI Manufacturing, from Atotech
Special Section and Articles
IMPACT Washington, D.C. 2016: Interviews and Editor’s Re-cap, by Patty Goldman, I-Connect007
The 21st Century PCB Factory—Designed to Eliminate Offshore Cost Advantages, by Alex Stepinski, Whelen Engineering
Columns
Patty’s Perspective: Impacting the Industry—Literally, by Patty Goldman
Trouble in Your Tank: Primary Imaging for Pattern Plating, Part 2: Development, by Michael Carano
The Right Approach: Our IoT Lives, by Steve Williams
Launch Letters: Exceptional Service—Extra Toppings without Sacrifice, by Barry Lee Cohen
This month, industry experts from OMG Electronic Chemicals, Uyemura, Atotech and the University of Leicester are on hand to dive deep into surface finishes, from OSPs for mixed-metal finishes to cutting-edge high-reliability surface finishes.
From our cover story on OSPs for mixed-metal finishes, contributed by industry veteran Michael Carano, to George Milad’s comprehensive look at IPC final finish specs, the February issue is bringing surface finishes front and center. Also contributing features this month: Rick Nichols (Atotech) who sheds light on the future of nickel in final finishes, and Andy Ballantyne et al., (University of Leicester) who detail HASLEN, a new high-rel surface finish for PCBs.
Features
Columns and More...
This month, the realm of HDI is explored, with features that delve into the issue of high-layer count multilayers, reliability, pinless registration & even bridging the divide between design & fabrication. Plus: IPC APEX EXPO show coverage!
Our feature line-up this month includes a co-authored cover story from Happy Holden (didn’t he retire?) and Mike Carano, who teamed up to provide an up-to-date look at the challenges of high-layer count multilayers. Plus, Paul Reid lends his expertise into HDI reliability, Raytheon’s Dan Smith offers his unique perspective on bridging the gap between design and fabrication, andVictor Lázaro Gallego walks us through the pinless registration process for multilayer in a Real Time with…feature video. Don’t miss our IPC APEX EXPO show coverage, with interviews, overviews and pictures from the show floor!
Understanding the ripple effects in the electronics supply chain will be key to manage the supply chain crisis and keep your fabrication facility running smoothly.
Understanding the ripple effects in the electronics supply chain will be key to manage the supply chain crisis and keep your fabrication facility running smoothly. In this issue, we bring you timely conversations with industry experts to help position your company’s offerings to the greatest effect.
Features
Articles
Columns
This month, we’re revisiting process engineering from the perspective of industry veterans with direct experience and who know what they’re talking about. Read what it’s all about, discover new techniques, gain fresh insights, and learn true appreciation for process engineeers, the backbone of PCB manufacturing.
This month, we’re revisiting process engineering from the perspective of industry veterans with direct experience and who know what they’re talking about. Read what it’s all about, discover new techniques, gain fresh insights, and learn true appreciation for process engineeers, the backbone of PCB manufacturing.
Table of Contents
Features
Articles and Columns
Handling and people-related mistakes and defects are always a concern in manufacturing. What's the answer? Is it automation? A little of both?
Handling and people-related mistakes and defects are always a concern in manufacturing. What’s the answer? Is it automation? Is it more training? A little of both? This month, our experts weigh in on the who, what, when, where and how of reducing handling errors.
Features
Columns
3D printing is happening, and it’s happening fast. What does this mean for PCB manufacturing and structural electronics? Find out this month in The PCB Magazine!
This month, The PCB Magazine feature contributors, including Dr. Jon Harrop (IDTechEx), Arjen Koppens (Dima Group B.V.), Karl D.D. Willis, Ph.D. (Autodesk), and Simon Fried (NanoDimension Ltd.) explore 3D printing and structural electronics. Find out what these technologies are bringing to the industry, plus columns, news highlights, events and MORE!
Features
Columns
It’s March materials madness in The PCB Magazine, with comprehensive coverage of materials, including features from leading experts at Ventec, Celestica, FTG, Rogers, Isolaand an IPC APEX EXPO pre-show guide!
Our comprehensive line-up this month includes our cover story by Ventec’s Ian Mayoh (Materials for High Operating Temperatures), plus more than a half-dozen other features from industry leaders at Celestica, FTG, Rogers, Isola, Dupont and more! Don’t miss our IPC APEX EXPO pre-show guide with schedules, offerings and featured programs.
In this issue, we provide a preview of the upcoming IPC APEX EXPO 2019 events, exhibitions, new technologies, awards, competitions, and standards work. So, relax and make your travel plans as we give you the big reveal!
There’s no better place to participate in the excitement and innovation of the printed circuit industry than at IPC APEX EXPO 2019. We preview the show, events, exhibitions, new technologies, awards, competitions, and standards work. Experience the magic that is our industry with IPC APEX EXPO. So, relax and make your travel plans as we give you the big reveal!
FEATURES:
ARTICLES & COLUMNS:
Exactly what defines process step elimination and/or automation? So many possibilities! Does it include reducing the number of steps in manufacturing a PCB? Eliminating queue times, inspection or cleaning steps?
Exactly what defines process step elimination and/or automation? So many possibilities! Does it include reducing the number of steps in manufacturing a PCB? Eliminating queue times, inspection or cleaning steps? Is automation adding a hoist to your plating line, or conveyorizing everything? These considerations and more by industry experts will give you plenty to think about as the summer sun sets on the horizon.
Table of Contents
Features
Columns
Article
Process engineers (and PE types) are the worker bees of the industry. Our experts this month bring first-hand knowledge of the phenomenon known as process engineering.
Process engineers (and PE types) are the worker bees of the industry. In addition to writing standards and specifications or presenting the technical papers at industry events, they stay busy behind the scenes—running tests, gathering data, coming up with new ideas, developing new products, and so forth. Our experts this month bring first-hand knowledge of the phenomenon known as process engineering.
Features
Columns and Articles
This month, The PCB Magazine looks to the horizon at new and emerging interconnects, with features by BPA and Ormet, along with a comprehensive collaboration between nScrypt and the University of Texas, El Paso.
This month, The PCB Magazine looks to the horizon at new and emerging interconnects, with features by BPA and Ormet, along with a comprehensive collaboration between nScrypt and the University of Texas, El Paso.
This month, The PCB Magazine brings the ins and outs of CAD/CAM especially for fabricators to the forefront with feature articles from the industry’s top experts.
This month, experts from Altium (Ben Jordon),CadSoft (Mark Toth), Mentor Graphics (Julian Coates), and Prototron Circuits (Mark Thompson) bring you in-depth articles that detail the ins and outs of CAD/CAM for fabricators. Plus: Columns, Real Time with… and more!
Today, there are still opportunities left in the PCB fabrication business to regain profit margin—some large and systemic, others small and incremental. One must make the choice to think differently about the business–and processes–to restore profitability.
Profitability is a multi-faceted subject. Today, there are still opportunities left in the PCB fabrication business to regain profit margin—some large and systemic, others small and incremental. One must make the choice to think differently about the business–and processes–to restore profitability.
Features
Articles
Columns
Of the driving forces in the PCB manufacturing marketplace today, one major contributor is medical device technology as it influences materials, components, manufacturing techniques, and procurement. In this issue, we investigate innovations surrounding the medical sector.
Of the driving forces in the PCB manufacturing marketplace today, one major contributor is medical device technology. Medical device development is influencing materials, components, manufacturing techniques, and procurement. In this issue, we investigate innovations surrounding the medical sector.
TABLE OF CONTENTS:
Features:
Columns and Articles
The present and future challenges of mil/aero electronics are covered from A to Zentech this month, from the DoD budget to the new cyber-security regulations, and of course, reliability issues, it’s all included.
The present and future challenges of mil/aero electronics are covered from A to Zentech this month, including a special interview section on IMPACT, Washington D.C. 2017. From the DoD budget to the new cyber-security regulations, and of course, reliability issues, it’s all included.
Features
Columns
Article
In this highly competitive industry of ours, where material costs squeeze from one side, and customers squeeze from the other, what is the answer to increasing profits? This month, our contributors offer strategies that we think will both surprise and enlighten!
In this highly competitive industry of ours, where material costs squeeze from one side, and customers squeeze from the other, what is the answer to increasing profits? This month, our contributors offer strategies that we think will both surprise and enlighten!
Features
Articles and Columns
Navigating the industry’s standards and regulations can be a lot like surfing a killer wave: One misstep and you could wipe out!
Navigating the industry’s standards and regulations can be a lot like surfing a killer wave: One misstep and you could wipe out! As EIPC Technical Director Michael Weinhold discusses with I-Connect007’s Pete Starkey, are standards and regulations a threat, or an advantage? Also on hand: Dan Gamota, who addresses standards for the monetization of PE, Dennis Fritz on the newly developing efforts of CAMEST, and IPC’s Dave Torp.
This month, The PCB Magazine brings surface finishes to the forefront with feature articles from the industry’s top experts. Plus, special content from productronica 2013!
This month, experts from Uyemura, Epec, and Fischer Technology take a deep look into surface finishes, including newest processes, pros and cons of available surface finishes, and more!
Don’t miss our productronica 2013 coverage, including thoughts from Pete Starkey and photos from the show floor!
There need to be benefits to any change—and transforming the manufacturing floor into a digital factory is a big change indeed! Learn some of the advantages that can be realized as new Industry 4.0 capabilities become available.
There need to be benefits to any change—and transforming the manufacturing floor into a digital factory is a big change indeed! In this issue of PCB007 Magazine, we look at some of the advantages that can be realized as new Industry 4.0 capabilities become available.
Features
Articles
Columns
GreenSource Fabrication, a New Hampshire division of Whelen Engineering, is rolling out an expanded facility that can claim to be the most advanced automated PCB facility in North America. It’s also zero waste and zero effluent.
GreenSource Fabrication, a New Hampshire division of Whelen Engineering, is rolling out an expanded facility that can claim to be the most advanced automated PCB facility in North America. It’s also zero waste and zero effluent. Take a detailed tour of the facility as we talk to the designers, staff, and equipment suppliers collaborating to make this facility a reality.
Features
Columns
Embedded technology seems finally to be coming into its own—thanks to Moore’s Law and the ever-pressing need for more real estate on the circuit board surface. No longer just for the odd, expensive military product, buried components can be found truly all around us!
Embedded technology seems finally to be coming into its own—thanks to Moore’s Law and the ever-pressing need for more real estate on the circuit board surface. No longer just for the odd, expensive military product, buried components can be found in that most ubiquitous of consumer products, the smartphone, as you will learn in this issue. They are truly all around us!
Features
Article and Columns
Extras: NEW! Career Opportunities Section, Events Calendar, News Highlights and more!
We’ve covered it from top to bottom this month—what’s brand new in the world of PCB fabrication and what’s on the horizon for our industry.
We’ve covered it from top to bottom this month—what’s brand new in the world of PCB fabrication and what’s on the horizon for our industry. Feature articles, interviews and columns reach into material and process solutions, 3D printing, surface finishing, and more!
Features
Articles and Columns
This month, The PCB Magazine presents the many sides of flex and rigid-flex circuits, which have myriad applications in just about every sector of the electronics industry.
This month, The PCB Magazine presents the many sides of flex and rigid-flex circuits, which have myriad applications in just about every sector of the electronics industry. Their ability to be formed into complex three-dimensional geometries, or to withstand multiple cycles during their functional life, adds a third dimension to the concept of the interconnecting substrate.
It's IPC APEX EXPO time again and we’re excited to bring the highlights you can expect to see while in San Diego. In this issue, hear from IPC team members Brook Sandy-Smith, Randy Cherry and Chris Mitchell as they weigh in with their insights on what to expect at this year’s show.
IPC APEX EXPO is here again. I-Connect007 has been previewing IPC APEX EXPO all month, and we’re excited to bring the highlights you can expect to see while in San Diego.
In this issue, Brook Sandy-Smith, IPC technical conference program manager, gives a detailed overview of what attendees can expect in the technical sessions, as well as some new and reconfigured events and resources on the technical conference side. Randy Cherry, IPC Validation Services and Chris Mitchell, IPC’s Government Relations Team weigh in with their insights on what to expect at this year’s show.
Features
Feature Columns
Columns
Bonus Content:
PCBs are approaching semiconductors with regard to feature sizes. Our experts this month are helping us understand substrate-like PCBs (SLP) and the semi-additive processes that will help the industry achieve the seemingly impossible.
PCBs are approaching semiconductors with regard to feature sizes. Given this growing trend that shows no signs of slowing down, our experts this month are helping us understand substrate-like PCBs (SLP) and the semi-additive processes (SAP) that will help the industry achieve the seemingly impossible (less than 25 micron features that are coming our way)!
Features:
Columns and Articles
Everyone is talking about the graying of our industry and the lack of qualified applicants for jobs, ranging from manufacturing personnel to engineers and even management. Who will take over when we retire?
Everyone is talking about the graying of our industry and the lack of qualified applicants for jobs, ranging from manufacturing personnel to engineers and even management. Who will take over when we retire? Do we simply find qualified individuals or create them? How do we attract and retain them? Find out this month in The PCB Magazine!
Features
Columns
We’re providing a thorough work-up for our readers this month, with features that diagnose the current state of the medical electronics segment. From robots and wearables to novel developments in gold metallization processes for neural probes, we’ve got head-to-toe coverage.
We’re providing a thorough work-up for our readers this month, with features that diagnose the current state of the medical electronics segment. From robots and wearables to novel developments in gold metallization processes for neural probes, we’ve got head-to-toe coverage.
Features
Columns and Articles
Our features this month question whether or not PCB manufacturers should even pursue the automotive electronics market due to design challenges.
This month, features from Saturn, BPA Consultants, Zuken and Delphi take on some big questions, beginning with whether or not a PCB manufacturer should even pursue the automotive electronics market, to the power of MiB, and other design challenges.
What we learned as we put this issue together is that there's a lot you need to know as a printed circuit fabrication professional. We bring you some selected categories of critical PCB fabrication expertise.
Our theme this month is “What You Need to Know,” and what we learned as we put this issue together is that there is a lot you need to know as a printed circuit fabrication professional. We bring you some selected categories of critical PCB fabrication expertise, plus some bonus coverage from productronica 2019 in Munich.
Features
Columns
Articles
Has the definition of reliability changed, and if so, why? What is driving this change? Reliability is critical, and the industry wants to deliver. This month, our experts provide their perspective on the evolution of reliability across sectors.
Has the definition of reliability changed, and if so, why? What is driving this change? One reason is clear: Electronics are not an occasional luxury, they are an integral and nearly constant component in most people’s daily lives, from automotive electronics to alarm systems to cellphones. Reliability is critical, and the industry wants to deliver. This month, our experts provide their perspective on the evolution of reliability across sectors.
Features
Columns
Do we really need more speed in our connections? If we want autonomous cars, intelligent robotics, extended IoT, then we must press forward with the development of high-speed materials. Our contributors this month examine our industry’s need for speed.
Do we really need more speed in our connections? If we want autonomous cars, intelligent robotics, extended IoT, then we must press forward with the development of high-speed materials. Our contributors this month examine our industry’s need for speed.
Features
Material Choices for High-Speed Flexible Circuits, by G. Sidney Cox
Interview: Fabricators Speak Out on High-Speed Materials, by I-Connect007 Research Team
PCB Technology Requirements for Millimeter-Wave Interconnect and Antenna, by Jim Francey and Terry Bateman
Interview: TTM Shines a Light on Optical Interconnect, by I-Connect007 Staff
Columns
Faster, Faster, Faster… or the Need for Speed, More Speed!, by Patty Goldman
Testing Todd: Go with the Flow, by Todd Kolmodin
Let’s Talk Testing: You’re in for a (Thermal) Shock! by Keith M. Sellers
Trouble in Your Tank: Copper-to-Copper Peeling, by Michael Carano
One World, One Industry: 100 Days In: President Trump and a Better Manufacturing Policy, by John Mitchell
Launch Letters: Nasty News Releases, by Barry Lee Cohen
Bonus Article
Executive Agent for PCB and Electronic Interconnect Technology PrCB Trust Accreditation, by Steve Vetter, et al.
Our final issue of 2015 is a view into various global associations that help our industry function and thrive. In their own words, top executives from around the world are on hand to provide an insider’s perspective of the who, what, where, when and why of their organizations.
Our final issue of 2015 is a view into various global associations that help our industry function and thrive. In their own words, top executives from around the world are on hand to provide an insider’s perspective of the who, what, where, when and why of their organizations.
Features
A Brief History of the Inception of IPC Expo, by Dan Feinberg
A Conversation with IPC President and CEO John Mitchell, by Patty Goldman
Dave Bergman: IPC's Technology & International Reach, by Patty Goldman
Is IPC the Past or the Future of our Industry? by Jason Marsh
EIPC: Furthering the Reach of Electronics Industries in Europe, by Barry Matties
In Their Words: China Printed Circuits Association (CPCA)
In Their Words: Hong Kong Printed Circuits Association (HKPCA)
In Their Words: India Printed Circuits Association (IPCA)
IPC's Fern Abrams: Keeping up with Regulatory Matters, by Patty Goldman
The Value of IPC’s Validation Services, by Patty Goldman
Dieter is Gone and I Don’t Feel So Good Myself! by Doug Sober
Working for the Industry: NTS’ Renee Michalkiewicz, by Patty Goldman
Catching up with Uyemura USA’s George Milad, by Patty Goldman
Columns
Field Notes: Are Local Industry Events the New Social Media? By Judy Warner
Testing Todd: 2015: It’s a Wrap! by Todd Kolmodin
E.I. Files: Insulated Metal Base Circuits—an Enabling Technology for Power Electronics, by Joe Fjelstad
More
Highlights: Top Ten 2015 Articles, Interviews, News and Videos
We demystify the often complex world of military electronics and DoD spending, demonstrate the utility of applications engineering to design and manufacturing of PCBs and explore the intersection of unmanned vehicles and electronics technology.
This month, STRATeVU’s Steve DeWaters demystifies the often complex world of military electron-ics and DoD spending, while Graphic Plc’s Ashley Luxton demonstrates the utility of applications engineering to PCB design and manufacturing. Finally, Circuit Solutions’ John Vaughan explores the intersection of unmanned vehicle systems and electronics technology.
In this issue, we update your prescription, clarify your vision of the industry, and bring your own perspective into view with a variety of interviews, columns and articles. Polish up your reading glasses and examine the stories inside.
In this issue, we update your prescription, clarify your vision of the industry, and bring your own perspective into view. With each interview, try on another outlook and look at the industry from another point of view.
Feature Interviews
Articles
Columns
With all the elements that can now affect the solder mask—finer features, higher-temperature solders, final finishes, direct imaging, inkjet—it’s high time to give this final fabrication process a little more attention.
With all the elements that can now affect the solder mask—finer features, higher-temperature solders, final finishes, direct imaging, inkjet—it’s high time to give this final fabrication process a little more attention. This month, our contributors explain how and why solder mask must do its job well—precisely, in fact.
Features:
Columns:
This month, we’re talking flexible circuits, including all the variations of same, which is why we’re calling this issue “The Wide World of Flex.” The world of flex is broad—and it’s rapidly getting wider!
This month, we’re talking flexible circuits, including all the variations of same, which is why we’re calling this issue “The Wide World of Flex.” The world of flex is broad—and it’s rapidly getting wider!
Feature Interview: American Standard Circuits Releasing e-Book on Designing Flex and Rigid-Flex
Feature Articles
Columns and Articles
Feature articles this month explore and explain why data is important, how to gather it (Internet of Things, for starters), and what exactly you can do with it once you’ve got it.
This month, The PCB Magazine presents, The Data Factor(y): The Power of Data. Feature articles explore and explain why data is important, how to gather it (Internet of Things, for starters), and what exactly you can do with it once you’ve got it.
Features
What is the Internet of Things and Why Should it Matter to Us? by Jason Marsh
Data Analytics through Statistical Techniques, by Steve Williams
Process Controls for Flexible Circuit Fabrication, by Dave Becker
The Power of Data: The Most Important Questions Any Leader Must Ask, by Dave Dibble
Articles and Columns
Data, Data and More Data! by Patty Goldman
Conducting Very High Currents through PCB Substrates at High Ambient Temperatures, from Schweizer Electronic AG
As Vias Shrink, Opportunities for Laser Drilling Expand, by Dirk Muller
Can Technology Be Too Disruptive? by Doug Bathauer
Karl’s Tech Talk: Digital Imaging Revisited, by Karl Dietz
This month, our feature columnists are explor-ing their various areas of expertise in the PCB industry by taking a look back, and forward, to where the industry is headed both domestically and globally.
This month, our feature columnists are explor-ing their various areas of expertise in the PCB industry by taking a look back, and forward, to where the industry is headed both domestically and globally.
FEATURES
The Wrap Up by Ray Rasmussen
2013: A Look Back, by Steve Williams
Can Scrap be Beaten? A Strategy for 2014 and Beyond by Gray McQuarrie
ARTICLES
Automated Optical Rework Replaces Manual Method by Bert Kelley
Why Procuring Flexible Printed Circuitry is Different by Thomas Stearns
COLUMNS
Achieving Fine Lines and Spaces: Part 2 by Michael Carano
Phototools, Part B, by Karl Dietz
This issue considers the current, ever-changing landscape of our industry, from global economics to emerging technologies and processes that may change how the manufacturing floor operates. With automotive electronics leading us down the road, don't find yourself asleep at the wheel.
For printed circuit fabricators, the terrain continues to change. While automation is a key part of our transformation, human expertise and problem-solving remain central to the process. This issue considers the current, ever-changing landscape of our industry, from global economics to emerging technologies and processes that may change how the manufacturing floor operates.
FEATURES
Articles
Columns
Much like the ubiquitous rubber ducky, it seems that PCB manufacturing has not changed much through the decades, but what has changed is the required precision of those steps to achieve ever finer features at ever higher quality and reliability.
Much like the ubiquitous rubber ducky, it seems that PCB manufacturing has not changed much through the decades, but what has changed is the required precision of those steps to achieve ever finer features at ever higher quality and reliability. This month, our experts offer up new wet processes, and tips and best practices for successful plating, and more.
Features
Columns
As technology moves increasingly faster, so do our equipment, materials and chemistry suppliers to help us to enable that next greatest invention. Are you ready for the next thing, to keep pushing forward? This month, our contributors shed a little light on that path forward. Meet the future!
As technology moves increasingly faster, so do our equipment, materials and chemistry suppliers to help us to enable that next greatest invention. Are you ready for the next thing, to keep pushing forward? This month, our contributors shed a little light on that path forward. Meet the future!
FEATURES
COLUMNS
Even more!
This month we are paying attention to cycle time and the many ways to reduce it in your process—whatever your process may be. From automation to value stream mapping to lean six-sigma, our contributors have it covered.
This month we are paying attention to cycle time and the many ways to reduce it in your process—whatever your process may be. From automation to value stream mapping to lean six-sigma, our contributors have it covered.
Patty’s Perspective: Cycling Around, by Patty Goldman, I-Connect007
Whelen Engineering Reduces Cycle Time by Building a New Automated PCB Factory, by Barry Matties and Bryan Bernas, I-Connect007
Whelen & IPS: A Strategic Partnership—A Winning Combination by Bryan Bernas
Mutracx: First Install Achieves CAM to Etch in 5 Minutes by Barry Matties
The Economics of Reducing Cycle Time in PCB Fabrication, by Jason Marsh, Insulectro
Practical Application of Lean Six-Sigma to Drive Cycle Time Reduction, Part 1, by Kathy Nargi-Toth, NCAB
Cycle Time Reduction in a Flexible Circuit Facility, by Dave Becker, All Flex
The PCB Marathon, by Renato Peres, Circuibras Circuitos Impressos Profissionais
Breaking the Bottleneck: Electrical Test Cycle Time Reduction, by Todd Kolmodin, Gardien
MacDermid: Redefining Global Strategy, by Barry Matties
Tips for Time-Critical PCBs, by Tara Dunn, Omni PCB
Plant Culture: a Direct Contributor to Quality, Output and Predictable Manufacturing, by Andy Thomson, EchoStar
The December issue is our end of year wrap up with an eye on 2015: What's on the horizon for the fab industry, at home and abroad?
Our industry experts, including Francesca Stern, Canice Chung, Dominique Numakura, and Sharon Starr tackle the year ahead with their perspective on what’s in store for the PCB industry in 2015, including North America, the Eurozone and Asia.
Features:
Columns
The process of reaching agreements when creating standards can be a long, arduous road to travel. In this issue, we report on recent developments in current and emerging standards and take a step back to discuss some of the inherent strengths and weaknesses of standards processes.
The flag standard became the symbol of the “rule of law” and a rallying point for those who supported that particular institution. It’s no small wonder, then, that the term has expanded to include other systems that function as law by mutual agreement. The process of reaching that agreement can be a long, arduous road to travel. In this issue, we look at standards both as processes and rallying points.
Features
Articles
Columns
What truly defines 5G, as compared to 4G and 3G? As the children say on road trips, are we there yet? Find out what is here, and what’s on the horizon for the industry and the world when it comes to the dawn of the 5G era.
What truly defines 5G, as compared to 4G and 3G? As the children say on road trips, are we there yet? Find out what is here, and what’s on the horizon for the industry and the world when it comes to the dawn of the 5G era.
Features
Columns and Articles
This month, our experts weigh in on new processes, the tried-and-true old processes, R&D, and how to go about choosing the right process from among all those available today.
So what is new in plating and surface finishes? This month, our experts weigh in on new processes, the tried-and-true old processes, R&D, and how to go about choosing the right process from among all those available today.
Features
Feature Columns
More Columns
Electronics in automobiles is increasing exponentially. We get under the hood and examine the proliferation of electronics in cars, what it’s like to be a supplier of PCBs destined for the automotive market, and where it is headed.
As you’ve probably noticed, electronics in automobiles is increasing exponentially. This month, our feature contributors get under the hood and examine the proliferation of electronics in cars, what it’s like to be a supplier of PCBs destined for the automotive market, and where this market is headed.
Detroit vs. Silicon Valley: What’s Driving the Proliferation of Automotive Electronics? by Jason Marsh, Insulectro
Automotive Technology: the Next Driving Force in Electronic Manufacturing, by Dan Feinberg, FeinLine Associates Inc.
Computer on Wheels, by Steve Williams, The Right Approach Consulting
Becoming an Automotive Supplier: Proceed with Caution, by Yash Sutariya, Saturn Flex Systems
How to Handle Short Development Cycles, by Davian Larente, Marquardt Switches Automotive Group
Car Makers Now Embracing Plasma Treatment: an Interview with Nordson MARCH, by Barry Matties, I-Connect007
Final Surface Finishes for Automotive: No One-Size-Fits-All Solution, by Tara Dunn, Omni PCB
The Impact of Automotive Trends on China’s PCB Supply Chain, an interview with Shengyi Technology Co. Ltd., by Edy Yu, I-Connect007
Columns
Patty’s Perspective: Cars, Cars, Cars! by Patty Goldman, I-Connect007
Karl’s Tech Talk: Dry Film Photoresist Structure and Composition, by Karl Dietz, Karl Dietz Consulting LLC
This month, industry experts from Starfish Medical, Dyconex AG, Micro Systems Tech., & Nypro discuss the latest progress in medical applications for PCBs.
Features
Columns
More
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